BANDUNG, INDONESIA – July 9, 2026 – In a significant move to strengthen cross-border technological cooperation, ICDEC Indonesia and Greatasic Malaysia officially signed a Letter of Intent (LOI) today during the Selangor International Business Summit held at the Pullman Bandung Grand Central.

This strategic partnership marks a significant milestone in fostering global collaboration between the two nations, with a specific focus on accelerating advancements in semiconductor chip design.

By combining expertise and resources, both organizations are committed to pushing the boundaries of research, innovation, and educational initiatives within the semiconductor sector.

“This collaboration is a testament to our commitment to fostering a robust ecosystem for semiconductor development,” said Professor Trio Adiono – Chairman of ICDEC.

“Together, we aim to bridge talent gaps and drive technological progress that will benefit the region’s rapidly evolving digital economy.”

The initiative seeks to cultivate a new generation of skilled professionals and researchers, ensuring that Indonesia and Malaysia remain at the forefront of the global semiconductor industry through shared knowledge and academic synergy.